Product Name: SiO2 Slurry
Feature: Extremely fine spherical particles with moderate hardness; ultra-low scratch rate, superior flatness and excellent cleanliness
Application: Final fine polishing of semiconductor wafers, sapphires, optical lenses and mobile phone glass
Description:
High-purity SiO₂ silica polishing slurry composed of ultra-fine spherical particles with moderate hardness.
It features ultra-low scratch rate, outstanding surface flatness and easy cleaning performance, designed for ultra-precision
final fine polishing of semiconductor wafers, sapphire substrates, optical lenses and mobile phone cover glass.
Applications:
1. Final precision CMP polishing of silicon semiconductor wafers
2. Ultra-fine surface finishing for sapphire crystal substrates
3. High-precision polishing of various optical glass lenses
4. Scratch-free fine polishing of mobile phone cover glass
Advantages:
1. Uniform spherical ultra-fine particles, moderate hardness avoids deep scratches
2. Ultra-low scratch rate, achieves ultra-smooth flat surface
3. Excellent cleanliness, easy to rinse without residual particles
4. Stable suspension performance, consistent polishing flatness
5. Suitable for ultra-precision electronic and optical component finishing
FAQ:
1. Q: What is the main component of this polishing liquid?
A: High-purity spherical silicon dioxide SiO₂ dispersed slurry.
2. Q: What materials can it polish?
A: Semiconductor wafers, sapphire, optical lenses, mobile phone glass.
3. Q: What’s its core advantage for semiconductor polishing?
A: Extremely low scratch rate and superior wafer flatness for chip manufacturing.
